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Gold-Ball

Gold wire 17 to 50 my for currents in mA range 1st bond ball-shaped, 2nd bond fishtail Loop of find out more

Manual Die-Bonding

simple manual operation, chips placed from waffle pack find out more

Pull-Testing for Wire Bonds

Check the quality of wire bonds find out more

Thin Wire Wedge

Aluminum wire 17 to 75 my for currents in mA range find out more

Shear-Testing Wire Bonds

Check the quality of wire bonds by measuring the shear force at which the wire bond is separated find out more

Ribbon

Gold or Aluminum ribbon, typically 12 x 75 µm * Mostly for microwave applications in mA find out more

Peel Testing for Wire Bonds

Check the quality of wire bonds by determining the peeling force at which the wire bond is peeled find out more

Heavy Wire Wedge

Al wire of 100 to 500 my for power devices, currents up to 50 A Wedge bonding with cutter after find out more

Shear Testing of Dies

Check die-bond quality by shear force find out more

Heavy Ribbon

for heavy aluminum ribbon find out more

Textur-Analyse

Textur von Füllmassen, Klebern etc. find out more

Bumping

using gold wire 25 to 50 my to make bumps or studs for flip-chips using models 5310, 53XXBDA, find out more

Other Materials

Copper wires and ribbons, coated wires (e.g. gold wires sputtered with Al), insulated wires find out more

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Series 56

A single basis for all bonding technologies find out more

5600 Semi automatic Pull- / Sheartester

Wire Pull, Ball Shear, Die Shear, Tweezer find out more

5600C Automatic Bond Tester

Pull-/Sheartester with automatic pattern find out more

5810 Automatic Gold-Ball Wedge Bonder

The Gold Ball Version of our new 58xx series with exchangeable find out more

Series 53

Semiautomatic wire bonder for find out more

5380 Die-Bonder

the 53XX BDA is now capable of find out more

5330 Thin Wire Wedge Bonder

Manual Wire Wedge Bonder 30, 45, 60 degree wire feed angle find out more

5600CS Fully Automatic Standalone-Bondtester

Standalone Pull-/Sheartester with automatic pattern find out more

Series 56

Too good to be true? All bonding technologies in a single table-top unit! Fully automatic! find out more

5830 Automatic Thin Wire Wedge Bonder

The Wedge-Wedge Version of our new Series 58 automatic wirebonder with exchangeable find out more

5610 Ball Bonder

Automatic and Semi Auto Ball find out more

5630 Thin Wire Bonder

Automatic and Semi Auto Wedge find out more

5632 Deep Access Bonder

Automatic and Semi Auto Deep Access Wedge find out more

5650 Heavy Wire Bonder

Automatic and Semi Auto Heavy Wire find out more

5650 Heavy Ribbon Bonder

Automatic and Semi Auto Heavy Ribbon find out more

5832 Automatic Deep Access Bonder

The Deep Access Version of our new Series 58 with exchangeable find out more

Series 58

New automatic wirebonder for medium find out more

5750 Lager Area-Bonder

Dickdrahtbonden auf fast 1 qm find out more

5850 Automatic Heavy Wire Wedge Bonder

The Heavy Wire Version of our new Series 58 automatic wirebonder with exchangeable find out more

5850HR Automatic Heavy Ribbon Bonder

The Heavy Ribbon Version of our new Series 58 automatic wirebonder with exchangeable find out more

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Success Stories

Standing wires

Bonding without a second bond more

Heavy Wire Repairs

Repairing automotive control units - simpler than one might think more

Academy

Die beste Ultraschallfrequenz

Die beste Ultraschallfrequenz

Welche Ultraschallfrequenz zum Drahtbonden am besten geeignet ist, hängt von einer Vielzahl von Faktoren more

Which Frequency is Best for Wirebonding?

more

Blog

Exhibitions 2016

Exhibitions 2016

Please visit us at following shows in more

How to achieve highest precision in your wire bonding process

How to achieve highest precision in your wire bonding process

Today’s wire bonding machines allow high precision processes and positioning tolerances of only a few micrometers mandatory for fine-pitch more