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Gold-Ball

Gold wire 17 to 50 my for currents in mA range 1st bond ball-shaped, 2nd bond fishtail Loop of find out more

Manual Die-Bonding

simple manual operation, chips placed from waffle pack find out more

Pull-Testing for Wire Bonds

Check the quality of wire bonds find out more

Thin Wire Wedge

Aluminum wire 17 to 75 my for currents in mA range find out more

Shear-Testing Wire Bonds

Check the quality of wire bonds by measuring the shear force at which the wire bond is separated find out more

Ribbon

Gold or Aluminum ribbon, typically 12 x 75 µm * Mostly for microwave applications in mA find out more

Peel Testing for Wire Bonds

Check the quality of wire bonds by determining the peeling force at which the wire bond is peeled find out more

Heavy Wire Wedge

Al wire of 100 to 500 my for power devices, currents up to 50 A Wedge bonding with cutter after find out more

Shear Testing of Dies

Check die-bond quality by shear force find out more

Heavy Ribbon

for heavy aluminum ribbon find out more

Textur-Analyse

Textur von Füllmassen, Klebern etc. find out more

Bumping

using gold wire 25 to 50 my to make bumps or studs for flip-chips using models 5310, 53XXBDA, find out more

Other Materials

Copper wires and ribbons, coated wires (e.g. gold wires sputtered with Al), insulated wires find out more

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Series 56

A single basis for all bonding technologies find out more

5600 Automatic Pull- / Sheartester

Wire Pull, Ball Shear, Die Shear, Tweezer find out more

5600C Automatic Bond Tester

Pull-/Sheartester with automatic pattern find out more

5810 Automatic Gold-Ball Wedge Bonder

The Gold Ball Version of our new 58xx series with exchangeable find out more

Series 53

Semiautomatic wire bonder for find out more

5380 Die-Bonder

the 53XX BDA is now capable of find out more

5330 Thin Wire Wedge Bonder

Manual Wire Wedge Bonder 30, 45, 60 degree wire feed angle find out more

5600CS Fully Automatic Standalone-Bondtester

Standalone Pull-/Sheartester with automatic pattern find out more

Series 56

Too good to be true? All bonding technologies in a single table-top unit! Fully automatic! find out more

5830 Automatic Thin Wire Wedge Bonder

The Wedge-Wedge Version of our new Series 58 automatic wirebonder with exchangeable find out more

5610 Ball Bonder

Automatic and Semi Auto Ball find out more

5630 Thin Wire Bonder

Automatic and Semi Auto Wedge find out more

5632 Deep Access Bonder

Automatic and Semi Auto Deep Access Wedge find out more

5650 Heavy Wire Bonder

Automatic and Semi Auto Heavy Wire find out more

5650 Heavy Ribbon Bonder

Automatic and Semi Auto Heavy Ribbon find out more

5832 Automatic Deep Access Bonder

The Deep Access Version of our new Series 58 with exchangeable find out more

Series 58

New automatic wirebonder for medium find out more

5750 Lager Area-Bonder

Dickdrahtbonden auf fast 1 qm find out more

5850 Automatic Heavy Wire Wedge Bonder

The Heavy Wire Version of our new Series 58 automatic wirebonder with exchangeable find out more

5850HR Automatic Heavy Ribbon Bonder

The Heavy Ribbon Version of our new Series 58 automatic wirebonder with exchangeable find out more

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Automotive

In the field of automotive electronics, our bonders are especially popular because of the high find out more

e-Mobility

Two applications dominate this field: power electronics to control the driving motors, secondly the find out more

COB - Chip on Board

COB circuits not only save space but are frequently the most cost-efficient alternative. Most often find out more

Surface Technology

Many suppliers offer leadframes, packages and circuit boards with bondable surfaces. The simplest find out more

PC Board Manufacturers

Ideal for outgoing quality checks: bond tests with a programmable bonder ensure perfect downstream find out more

Hybrid Manufacturers

For all surfaces, whether thin film or thick film - the right bond equipment for different wire find out more

Microwave

High-frequency circuits often require extremely small and short gold wire bonds or ribbons. The find out more

Medical Electronics

Highest bond quality at small production volumes is characteristic for this application. Our find out more

Communication

Many different packaging technologies are employed here, depending on the kind of microwave or find out more

Aerospace / Military

Microwave circuits are the prevalent technology in space and military electronics, and find out more

Sensors

The biggest challenge when bonding sensor chips are the surfaces which very often are extremely find out more

Solar Technology

Wire and ribbon bonding are mostly employed for concentrator cells which feature very small but find out more

Quality Control

Only our automatic and programmable bond tester 5600C guarantees perfect results without any find out more

EMS Providers

Time-to-Market is quite often the key to their success. Our 56XX series is unsurpassed for sample find out more

R&D

Flexibility and convertibility for future applications are the trump cards here. Our 56XX series is find out more

Semiconductor

Flexibility and convertibility for future applications are the trump cards here. Our 56XX series is find out more

Laser Diodes

Laser Diodes are very expensive, making high yields the prime objective. Usually built on very find out more

LED

A very large variety of LEDs ranging from low to high power demand a large range of different find out more

Success Stories

Standing wires

Bonding without a second bond more

Heavy Wire Repairs

Repairing automotive control units - simpler than one might think more

Academy

The best ultrasonic frequency for bonding

Which ultrasonic frequency is best suited for wire bonding depends on a number of influence factors. This paper discusses them in some more

Which Frequency is Best for Wirebonding?

more

Blog

Exhibitions 2016

Exhibitions 2016

Please visit us at following shows in more

Not only flexible, but also fully automatic

Not only flexible, but also fully automatic

Flexibility does not have to cause technological drawbacks. The 56 series is a full-fledged production solution, that can easily compete with a fully more