Gold or Aluminum ribbon, typically 12 x 75 µm
* Mostly for microwave applications in mA range
* Wedge process with very flat bonds
* Bonding with heating for gold, without heating for aluminium
The bonder for ribbons has a wire feed angle of 90° and can also process wires. The bond assembly’s narrower contour is advantageous in limited geometries.
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Gold or Aluminum ribbon, typically 12 x 75 µm * Mostly for microwave applications in… more