This machine stays forever young because it grows with the requirements and the technology. The best way to protect your investment.
All bonding parameters can be programmed for any number of bonds or bumps.
Programmed wires are shown schematically on the screen and can be selected and grouped with the mouse.
Numerous programmable Loopforms with automatic correction after adjustment by the operator or (optional) image recognition.
Workspace of the mechanical stage 100×100 mm, 60 mm z-stroke.
Each bond head includes a miniature color camera for positioning the bonding tool with adapted optics for optimal magnification. The bond head can rotate 360 degrees, so that the workpiece does not have to be rotated.
The different bonding and test heads can be replaced in minutes by the operator:
|Thin Wire-Bonder for Gold-Ball-Bonding:||5610|
|Thin Wire-Bonder for Wedge-Wedge-Bonding:||5630|
|Deep-Access-Bonder for wire and ribbon:||5632|
|Heavy Wire-Wedge-Bonder for Alu- and Cu-wires:||5650|
|Wedge-Bonder for heavy Aluminium-Bändchen:||5650HR|
A single basis for all bonding technologies