BAMFIT (Bond Accelerated Mechanical Fatigue Interconnection Test) is an entirely novel test method for assessing the reliability of heavy-wire wedge bonds and thin-wire ball bonds. It is the perfect extension of the classic power cycling test (PC): the cyclic stress imparted to the wire bond by temperature changes is emulated by mechanical stress loading, but at a significantly higher cycle rate. This allows PC tests that can take weeks or months to be simulated within minutes.
The patent-pending BAMFIT tester thus permits a qualitative estimate of the lifetime and reliability of wire bonds, either as process diagnostics or for optimizing bond process parameters.
The rervolution in bond-Testing. The BAMFIT-Tester. BAMFIT (Bond Accelerated Mechanical Fatigue Interconnection Test)