Exhibitions 2018

Exhibitions 2018

Every year, F&S BONDTEC is represented at the top technology fairs worldwide.

There you can have a look at our latest products, updates or supplements. Our employees and representatives will take care of your request. Please visit us at the following fairs. We look forward to meet you there!

 

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UPCOMING FAIRS

Germany:

EBL – Elektronische Baugruppen und Leiterplatten 20 – 21 Februar 2018

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IMAPS Frühjahrsseminar 2018 – 15 März 2018
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SMT Hybrid Packaging 5 – 7 Juni 2018, Messe Nürnberg
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Japan:

NEPCON JAPAN – 17 – 19 Januar 2018

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China:

Semicon S – 17 – 19 Januar 2018

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COMPLETED FAIRS

 

Germany:

Productronica 14 – 17 November 2017, Fair Munich

Booth B2.427

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SMT Hybrid Packaging 16 – 18 May 2017, Fair Nürnberg

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Spain:

Matelec 25 – 28 October 2016
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Asia:

Semicon China 15. – 17. March 2016, Shanghai

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Semicon Taiwan 7 – 9 September 2016
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Russia:

ExpoElectronica 15. – 17. March 2016, Moskau

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Germany:

SMT Hybrid Packaging 26. – 28. April 2016, Messe Nürnberg

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Poland:

EICO 2016 +OWTNM 18. – 21. May 2016, Warsaw

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USA:

Semicon West 12. – 14. July 2016, San Francisco

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