Once again there are some exciting news to report – this time from our top bonder: Series 58. In an internal experiment, we were able to bond gold Ball-Wedge with 12.5 μm wire. The results are convincing; Thus, we can now offer Gold Ball Wedge starting from 12.5 μm for Series 58. Further test results will be published on our website in the future. If you would like further informations now, you can contact our Sales Manager Stefan Berger (+43 7722 / 67052-8278) or send an e-mail to firstname.lastname@example.org.
This breakthrough is remarkable in many ways. Due to the constant miniaturization in the semiconductor industry, it is also necessary to make the connection between parts as efficient as possible. Thin wire applications are commonly used in high frequency and in fine pitch applications. Especially highly technical industries, such as aerospace, can benefit from bonding with 12.5 μm wires.