30 Jahre F&S BONDTEC
F&S BONDTEC celebrates 30 years of innovation and success in the semiconductor industry! For three decades we have been a reliable partner for our customers worldwide. We would like to thank our employees, customers and partners for their support on this exciting journey!
Some of the highlights were:
- A look back at the past 30 years
- A guided tour of the company premises
- The subsequent celebration in the party tent
As part of the celebrations, our founder and owner Siegfried Seidl was awarded the silver business prize – in recognition of his outstanding commitment and the successful achievements of F&S BONDTEC in the semiconductor industry over the last three decades.
To mark our anniversary, we would like to thank you with a special promotion:
Receive a 10% discount on the following products:
- DUSG (Digital Ultrasound Generator)
- MCS (Mobile Calibration System)
- External heating unit
D USG-X
Our universal, fully digitally controlled ultrasonic generator offers a wide frequency and power range and is compatible with all common transducers from all manufacturers. This versatile generator is ideal for various applications and combines advanced control with high flexibility.
MCS (Mobile Calibration System)
The MCS (Mobile Calibration System) measures bond weight and temperature precisely and enables data transfer via USB to a PC for evaluation and storage. Instructions for bond weight calibration can be found in the bonder manual, and only trained personnel should perform this calibration on the bonder.
External heating unit
Our external heating unit brings substrates to the optimum bonding temperature before the bonding process to avoid prolonged heating on the bonder. This saves you valuable process time and increases throughput, while at the same time increasing the strength and reliability of the bonded joints.
Once again this year, F&S BONDTEC had the privilege of presenting our innovations at important trade fairs and conferences worldwide, thus strengthening our position as a leading company in the field of joining technology.
- PCIM Europe 2024: In June, we exhibited at PCIM Europe in Nuremberg for the first time. The trade fair gave us a wonderful opportunity to present our tried-and-tested solutions for the semiconductor industry and to talk to many interested visitors.
- Semicon Taiwan: Together with Bondtronics, we presented our wire bonders and bond testers in Taiwan and held interesting discussions with local experts.
- ESREF in Parma, Italy: At this prestigious event on reliability in the semiconductor industry, our representative Stefan Berger presented our advanced bonding solutions – suitable for everything from prototypes to series production.
- Austrochip 2024, Vienna: We proudly took part in Austrochip, the platform for micro- and nanoelectronics in Austria. Our colleague Dr Bernhard Rebhan gave a presentation and shared important insights into our latest innovations.
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IMAPS Boston: In Boston, we presented our wire bonders and bond testers for battery technology and demonstrated their performance in modern production processes.
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Battery Show North America: Together with Boston Micro-Components and acp systems AG, we presented our Series 86 bonding machine in Detroit, which is optimised for bonding battery packs of all sizes. An exciting opportunity to demonstrate how our solutions meet the needs of today’s battery and semiconductor industry.
- InterNanoPoland: At the international InterNanoPoland conference, Stefan Berger and our Polish representative Katarzyna Piekarska from Prokon presented our solutions in the field of advanced materials and electronics. They presented the Series 53 manual wire bonder and used the platform to discuss current developments and successes with companies and organisations.
