The 56 Series of F&S Bondtec uses a configurable head design to give the user absolute versatility in test setups: from manual standalone testers to separate test heads as addition to a fully automated wire bonding system – with pull or shear test options for thin and heavy wires.
The test head for fully automated wire bonding systems is the most compact pull and shear tester available in the market today. Requiring far lower investments than traditional solutions, it can handle all test scenarios on one automated device platform. The standalone tester was designed for use in high-throughput manufacturing environments. Production processes are made more efficient with reduced changeover times and fewer resource bottlenecks in the facilities.