Archives: Services

F&S BONDTEC - Applications

Textur-Analysis

Textur-Analysis >> Characterize filling compounds or adhesive by its texture: >> viscosity >> toughness >> elasticity >> stickiness >> automatically measured with 5600 TA Machines for Textur-Analysis Automatic Bonder & Tester 5600C Read More

Shear-Testing for Dies

Shear-Testing >> Check the die-bonding quality by determining the shear force at which the die is separated from the surface. automatically with model 5600C, manually with model 5600 Machines for Shear-Testing of Dies Automatic Bonder & Tester 5600C Semi-automatic Bonder & Tester 5600 Read More

Peel-Testing for Wire Bonds

Peel-Testing >> Check the quality of wire bonds by determining the peeling force at which the wire bond is peeled off the substrate. automatically with Model 5600C, manually with Model 5600 Machines for Peel-Testing for Wire Bonds Automatic Bonder & Tester 5600C Semi-automatic Bonder & Tester 5600 Read More

Shear-Testing for Wire Bonds

Shear-Testing >> Check the quality of wire bonds by measuring the shear force at which the wire bond is separated from the substrate. Preferred for heavy wire wedge bonds and for ball bonds. Machines for Shear-Testing Wire Bonds Automatic Bonder & Tester 5600C Semi-automatic Bonder & Tester 5600 Read More
Drahtbond Pull Test

Pull-Testing for Wire Bonds

Pull-Testing >> Quality check of wire bonds by determining the pull strength at which the bonded wire fails. Machines for Pull-Testing for Wire-Bonds Automatic Bonder & Tester 5600C Semi-automatic Bonder & Tester 5600 Read More
Die Bonding

Manual Die-Bonding

Die-Bonden mit Kleber >> simple manual operation, chips placed from waffle pack on adhesive dispensed in a separate step. Machines for manual Die-Bonding SERIES 53 SERIES 56 SERIES 58 Read More

Other Materials

Copper wires and ribbons, coated wires >> Copper wires and ribbons, coated wires (e.g. gold wires sputtered with Al), insulated wires (back-lack insulation) can be bonded without problems. >> They are used in specialized applications and are usually bonded by wedge-wedge process. Machines for other Material SERIES 53 SERIES 56 SERIES 58 Read More

Bumping

Bumping >> Stud bumps from gold wire 25 to 50 µm for flip-chip applications in programmable sizes, also stackable. Machiens for Bumping SERIES 53 SERIES 56 SERIES 58 Read More

Heavy-Ribbon

Heavy-Ribbon >> Heavy Aluminium Ribbon up to 2000 x 300 µm cross section for even higher currents. >> The bond head is a stronger version of the heavy wire bondhead. Machines for Heavy-Ribbon-Bonden SERIES 53 SERIES 56 SERIES 58 Read More

Heavy-Wire-Wedge

Heavy-Wire-Wedge >> for power devices, currents up to 50 A >> Wedge bonding with cutter after 2nd bond >> very robust process, extremely popular >> Aluminium wire of 100 to 500 µm >> CU Wire of 100 – 300 µm Machines for Heavy-Wire-Wedge SERIES 53 SERIES 56 SERIES 58 Read More