BAMFIT - Bondtec Accelerated Mechanical Fatigue Interconnect Testing
>> Special attention is paid to the quality of the bonds
>> Life of the bond has to be maximized. However, this is not quite trivial
>> The BAMFIT method measures the number of load changes until breakage
Bond wire connections must hold for several decades and under high thermomechanical loads. The optimization of bond connections is currently being implemented with static pull and shear tests. Indications of the long-term reliability are only given by time-consuming load change tests and empirical values.
To fill this gap, a highly-accelerated test method for determining the lifetime of bond wire connections has been developed and converted to an extremely fast automatic quality test using a state-of-the-art bond tester.
This makes it possible to determine an estimation of the fatigue behavior of bond wire feeders in a very short time.