Archives: Services

Bumping

Bumping >> Stud bumps from gold wire 25 to 50 µm for flip-chip applications in programmable sizes, also stackable. Bumps US sheared Some special customer applications require individual Bumps. The excess wire is sheared with the capillary by the tear-off movement. However, this creates the problem that the wire often deviates to the side and [...] Read More

Heavy-Ribbon

Heavy-Ribbon >> Heavy Aluminium Ribbon up to 2000 x 300 µm cross section for even higher currents. >> The bond head is a stronger version of the heavy wire bondhead. What is Heavy-Ribbon Bonding? Instead of a normal wire, it is also possible to bond ribbons. These ribbons, typically made of gold or aluminum, are [...] Read More

Heavy-Wire-Wedge

Heavy-Wire-Wedge >> for power devices, currents up to 50 A >> Wedge bonding with cutter after 2nd bond >> very robust process, extremely popular >> Aluminium wire of 100 to 500 µm >> CU Wire of 100 – 300 µm What is Heavy-Wire-Wedge-Wedge Bonding? Heavy-Wire-Wedge-Wedge bonding is a variant of wire bonding that uses a [...] Read More

Ribbon

Ribbon >> Gold or Aluminum ribbon, typically 12 x 75 µm >> Mostly for microwave applications in mA range >> Wedge process with very flat bonds >> Bonding with heating for gold, without heating for aluminium >> The bonder for ribbons has a wire feed angle of 90° and can also process wires. The bond assembly’s [...] Read More

Thin-Wire-Wedge

Thin-Wire-Wedge Thin-Wire-Wedge-Wedge bonding is a variant of wire bonding that uses a wedge-shaped tool to connect thin wires to the bond pads of a substrate. With our 5330, 5630i or 5830-bondheads, aluminum and gold wires from 12 to 75 µm diameter can be bonded. How does it work? The process steps for wedge-wedge bonding are [...] Read More

Gold-Ball

Gold-Ball >> Gold wire 12,5 to 50 µm >> for currents in mA range >> 1st bond ball-shaped, 2nd bond fishtail >> Loop of any shape >> heated package (over 150°C) >> Robust, widely used, corrosion resistant What is Ball-Wedge Bonding? The process begins with the formation of the ball at the tip of the wire [...] Read More