The stability of a bonding process is largely determined by the wire bonder’s pattern recognition unit (PRU). F&S Bondtec’s most sophisticated bonders, the 56xx and 58xx series, use advanced Asoss vision software that has been specially adapted to the requirements of wire bonders, to master even the most complex pattern recognition tasks. The wide range of materials that can be processed using the software includes PCBs, housings, ceramics with printed traces, thin-film structures, DCBs, semiconductors and fine machining processed surfaces.
More than 20 different parameters can be configured, allowing for unique fine-tuning of settings such as contour, quality score and color channels. Adjustment effects are displayed in real time, with PRU model statistics providing extra information. A particular help to the operator is the ability to define the recognition area as needed. As opposed to conventional systems, in which only rectangular search and analysis areas can be set, F&S Bondtec’s solution offers extra flexibility – the operator simply sketches out the area to be analyzed freehand using the mouse.
Configuring the PRU is as easy as pie thanks to the
real-time feedback and innovative features
