Category: News

F&S BONDTEC - News

F&S BONDTEC wishes Merry Christmas

F&S BONDTEC wishes Merry Christmas We wish our customers and business partners a Merry Christmas and a Happy New Year 2020. Thank you for your trust We have Christmas holidays from: 23.12.2019 – 05.01.2020 We refrain from Christmas gifts, instead, we donate for social aid…
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25 years of F&S BONDTEC in pictures

25 years of F&S BONDTEC in pictures In the course of our company anniversary, we look back on the milestones in our company history. In the following article, we introduce you to some highlights from 25 years of F&S. We hope you enjoy watching our…
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We are celebrating our 25th anniversary at the Productronica in Munich

We are celebrating our 25th anniversary at the Productronica in Munich We are happy to invite you to celebrate together with us on 13.11.2019 from 18:00 at the Productronica in Munich the TWENTY-FIVE-YEARS anniversary of F&S BONDTEC. Our milestones In the course of our company anniversary we…
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Battery bonding for the AGH Racing Team

The AGH Racing Team Poland The AGH Racing is a Polish racing team participating in the Formular Student. The team consists of ambitious students whose dream is to build racing cars for the Formular Student Cup. F&S BONDTEC has supported the group of students in…
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12.5 μm gold ball wedge bonding with the Series 58

Once again there are some exciting news to report – this time from our top bonder: Series 58. In an internal experiment, we were able to bond gold Ball-Wedge with 12.5 μm wire. The results are convincing; Thus, we can now offer Gold Ball Wedge starting…
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New BONDTEC Academy

New BONDTEC Akademy From now on we offer new training modules for bondtester. The training modules include training packages for our 5600C(S) Pull- and Sheartester. With our experts, your installers, process- and qualitymanagers are in the best hands. The training will happen preferentaly in the premises of…
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Workshop – automatic Bond testing: Suzhou – China

In order to bring our understanding of automated bond testing closer to our industrial customers, F&S BONDTEC and our distributor MPS organized a workshop in Suzhou China. In the practical part, customers could have their own products tested in the course of a demonstration on…
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Wire bonding and beyond – bumping technology for low-loop and Flip-chip application

Low loop geometry (low-loop application) can be implemented most suitable while using reverse bonding from substrate to chip in combination with stich-on-bump. The basis for a robust process is the production of homogeneous bumps with a flat surface, that serves as a bonding surface for…
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Challenging Traditional Pull-Tester

Challenging Traditional Pull-Tester
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5600 CS – Fully Automatic Bond Tester

The 5600 CS fully automatic pull and shear tester can conduct independent pull and shear tests with automatic image recognition technology and programmable bond layouts. The automated process accelerates testing significantly, improves repeatability, and eliminates any interference by the operator affecting the test results. This…
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