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The right connection technology facilitates market entry for battery packs
Many applications require battery packs of different types and quantities. A central production step is the interconnection of the battery cells. But which technology is the most suitable? Check out this article to find out.
Testing power electronics in minutes instead of months
The high demands on automotive electronics – e.g. a lifetime of at least 20 years – are a challenge for semiconductor chips and their external connections. Conventional tests take a long time. A practical problem that is now solved by a new test procedure.
Interface characterization of Cu-Cu ball bonds by a fast shear fatigue method
A highly accelerated shear fatigue testing method is presented to test the long-term reliability and reveal the bonded interface of thermosonic CueCu ball bonds. The method is an adaptation to a new industrial fatigue tester (BAMFIT) and can be conducted without an intricate specimen preparation.
