Service Category: Wire-Bonding

Battery bonding

Battery bonding Many applications require battery packs of different types and quantities. A central production step is the interconnection of the battery cells. But which technology is the most suitable? For the interconnection of cylindrical lithium battery cells, this is primarily wire bonding. This technology is established in semiconductor technology and is characterized above all [...] Read More

Bumping

Bumping >> Stud bumps from gold wire 25 to 50 µm for flip-chip applications in programmable sizes, also stackable. Bumps US sheared Some special customer applications require individual Bumps. The excess wire is sheared with the capillary by the tear-off movement. However, this creates the problem that the wire often deviates to the side and [...] Read More

Heavy-Ribbon

Heavy-Ribbon >> Heavy Aluminium Ribbon up to 2000 x 300 µm cross section for even higher currents. >> The bond head is a stronger version of the heavy wire bondhead. What is Heavy-Ribbon Bonding? Instead of a normal wire, it is also possible to bond ribbons. These ribbons, typically made of gold or aluminum, are [...] Read More

Heavy-Wire-Wedge

Heavy-Wire-Wedge >> for power devices, currents up to 50 A >> Wedge bonding with cutter after 2nd bond >> very robust process, extremely popular >> Aluminium wire of 100 to 500 µm >> CU Wire of 100 – 300 µm What is Heavy-Wire-Wedge-Wedge Bonding? Heavy-Wire-Wedge-Wedge bonding is a variant of wire bonding that uses a [...] Read More

Ribbon

Ribbon >> Gold or Aluminum ribbon, typically 12 x 75 µm >> Mostly for microwave applications in mA range >> Wedge process with very flat bonds >> Bonding with heating for gold, without heating for aluminium >> The bonder for ribbons has a wire feed angle of 90° and can also process wires. The bond assembly’s [...] Read More

Thin-Wire-Wedge

Thin-Wire-Wedge Thin-Wire-Wedge-Wedge bonding is a variant of wire bonding that uses a wedge-shaped tool to connect thin wires to the bond pads of a substrate. With our 5330, 5630i or 5830-bondheads, aluminum and gold wires from 12 to 75 µm diameter can be bonded. How does it work? The process steps for wedge-wedge bonding are [...] Read More

Gold-Ball

Gold-Ball >> Gold wire 12,5 to 50 µm >> for currents in mA range >> 1st bond ball-shaped, 2nd bond fishtail >> Loop of any shape >> heated package (over 150°C) >> Robust, widely used, corrosion resistant What is Ball-Wedge Bonding? The process begins with the formation of the ball at the tip of the wire [...] Read More