F&S BONDTEC on Internepcon 2019 in Tokio

F&S BONDTEC - Fairs - F&S BONDTEC on Internepcon 2019 in Tokio

F&S BONDTEC at Internepcon 2019 in Tokio

From 16th to 18th January F&S BONDTEC participated at the annual Internepcon Show at the Tokyo ‚Big Sight‘ exhibition center.

The Internepcon in Tokyo is a trade fair for manufacturing technology for production of electrical products. It is one of the largest trade shows for the industry in Asia and attracts visitors every year from the sectors electrical appliances, semiconductors and automotive.

As always, the show offered high quality information and we had several informative discussions with our high valued customers and international partners.

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