We are F&S BONDTEC. For 25 years, we have been supplying solutions for wire bonding technology. Many people remember us as F&K Delvotec Austria, but this has changed since 2015. We are F&S BONDTEC – your partner for customized, intuitive and productive solutions in wire bonding production and in the quality monitoring.
• a wide variety of products
• with short development cycles
• but at a reasonable cost at the same time
• and above all: with very high qualitycan be manufactured.
“Time to Market“ and „High-Mix Production“ are crucial parameters for a successful appearance on the market. The solution is platform concepts – individually adaptable, quickly configurable and where quality is at eye level with pure production solutions. F&S BONDTEC 56xx Desktop Micro Factory offers this platform strategy with more than 10 years of market maturity.
F&S BONDTEC has been developing bonding and bondtesting technology solutions for more than 25 years. F&S BONDTEC many years of experience, the associated knowledge and the excellently trained employees have made F&S BONDTEC the global market and innovation leader in desktop bonding equipment. A major part of these innovations is the 56xxDesktop Micro Factory, which masters all wire bonding technologies and bond testing on a single machine.
