Highlights Bondtester, news about BAMFIT SpeedCycle and our currently planned trade fairs

F&S BONDTEC - Fairs - Highlights Bondtester, news about BAMFIT SpeedCycle and our currently planned trade fairs

Highlights Bondtester, news about BAMFIT SpeedCycle and our currently planned trade fairs

Welcome to the new year! We at F&S BONDTEC have been back for you since January 11th, 2021. In this newsletter, we present our highlights among our bond testers, news about BOND-IQ SpeedCycle, and our currently planned trade fair appearances.

Our bond testers

The new edition of our SERIES 56 has been available since last year. As the first and still the only manufacturer, F&S BONDTEC offers a machine that combines bonder and tester in one device. With it, it is possible to switch between different applications within minutes. The SERIES 56i has retained its basic features – but offers a lot more.

You don’t need a fully automatic machine yet? We also have the perfect entry-level equipment, our Pulltester LT-101. It couldn’t be any simpler: touchscreen and mini-joysticks take care of smooth operation, learned within minutes. The measuring range covers pull forces between 0 – 100 cN or 0 – 2.000 cN for thin or heavy wires. The test results are shown on the screen and also stored in a PDF file on a USB stick so they can be evaluated in any QA system of your choice.

BAMFIT-SpeedCycle

SpeedCycle is a multi-client project. Companies interested in progress in a technology area come together in a working group and invest together in the success of the project. This enabled SpeedCycle to start within a very short time and achieve project results. In the case of BAMFIT, the company Bond-IQ GmbH is currently carrying out a “Potential evaluation of the BAMFIT method for interface evaluation on heavy wire bonds as an alternative to the heavy wire shear test” in close cooperation with Fraunhofer IZM Berlin. We can already publish some exciting use cases from it:

    • Reliability assessment of wire bonds on semiconductor
    • Interface analysis of wire bonds on different surfaces (area and volume)
    • Shear strength evaluation of the bonded interface [N/mm²] for material characterization
    • Wire loop strength during mechanical cycling Application on Cu ball bonds
    • Vibration and dampening analysis on bonding pads (e.g. injection molded housings). Often this is done by complex laser vibrometry.

     

Here are our current trade fair dates for this year.

We hope to see you in person again in 2021!

Semicon Shanghai March 17-19, 2021 Shanghai New International Expo Center, Shanghai, China

Semicon China is the most important trade fair for semiconductor manufacturing machines and materials in China. At the same time, Semicon China has overtaken the trade fairs of the same name in the USA and Japan in terms of size.

CIBF2021 Shenzhen March 19-21, 2021 Shenzhen Convention & Exhibition Center, Shenzhen, China

The CIBF – China International Battery Fair is the world’s largest trade fair for batteries and takes place in Shenzhen. The organizer of the fair CIAPS is China’s leading association for battery technology. In addition to all types of battery products, exhibitors also present production technologies such as machines, systems, materials and measurement and testing technology, thus uniting all areas of the industry under one roof.

SMTconnect May 4th – 6th, 2021 Nuremberg Exhibition Center, Nuremberg

SMTconnect is the only trade fair for electronic production in Europe that brings people and technologies from the areas of development, production, services, and the applications of microelectronic assemblies and systems together in an inspiring work atmosphere.

Battery Experts Forum October 5th – 7th, 2021 Messe Frankfurt, Frankfurt

The Battery Experts Forum is the biggest conference and exhibition for battery technology. The event takes place annually at Forum Messe Frankfurt. Over 100 experts from the leading battery manufacturers and users provide information on the newest trends, product developments and solutions. The event will be accompanied by a specialized exhibition with more than 160 exhibitors, who are among the most important companies in the entire battery supply chain.

Productronica November 16-19, 2021 Messe München, Munich

As the largest international event for the electronics manufacturing industry, productronica is the only trade fair in the world to cover the entire value chain. It unites all elements of the innovative development and manufacture of electronics and is the most important platform for innovations and world premieres – from technologies to software to services.

Do you have any questions about our products? We look forward to your inquiry at:

+43 (0)7722 67052-8270 or under: info@fsbondtec.at

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