How to achieve highest precision in your wire bonding process

F&S BONDTEC - News - How to achieve highest precision in your wire bonding process

Today’s wire bonding machines allow high precision processes and positioning tolerances of only a few micrometers mandatory for fine-pitch applications. This accuracy is achieved by precisely crafted mechanical components and careful assembly. But the abilities of mechanical systems are limited. However, sophisticated software algorithms and precise measurement systems can noticeably improve the level of achievable accuracy.

Profiles of bonding table accuracy can be measured using calibrated linear graduation systems made of float glass. The measurement shows deviations between programmed and real bonding table position. These deviations can then be compensated by software. Implementation is easy as pie!

The F&S calibration kit has to be mounted on the bonding table, software for calibration has to be started, pattern recognition needs to be set-up and all the rest will be done automatically. The wire bonder moves to every structure on the linear graduation system and verifies its real position by automatic pattern recognition. Deviations are detected and compensated by software algorithms.

This all runs in the background so that the user does not have to deal with complex algorithms or settings. The results will be stored as base-setup in the machine and improve wire bonder accuracy in every bonding program from now on. No wire bonding program has to be updated or rewritten.

The calibration tools are manufactured by a specialized company with more than 40 years of experience in high precision linear graduation systems. The implementation of soft- and hardware is made as easy as possible so that every user can start a calibration procedure at any time. This makes our wire bonder a valuable high precision manufacturing system compensating possible wear out of mechanical components in heavy duty production even after long time of use. Insofar it is useful to be able to make such calibration whenever you want.

The only requirement is an update to the bonding star software which is available since 2 years now. The calibration kit is recommended when it comes to pad sizes <100 µm or wire diameters <25 µm, when clamping is regularly exchanged or a high precision must be achieved in general (e.g. RF-applications with small bonding pads, fine-pitch applications, stud-bumping).

F&S calibration kit – a plug-and-play
solution for highest precision

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