Publications

Here you find publications from relevant industry magazines as well as scientific articles from research and development.

Title	Author	Published	Date	Link
High density cleanroom-free microneedle arrays for pain-free drug delivery	Thomas Lijnse et al	IOP Science	12/2022	E-Paper
The right connection technology facilitates market entry for battery packs	Dr. Josef Sedlmair	SMT Insights	05/2021	E-Paper
Application Report: Ball/Wedge wire bonding with gold wire on a Direct Immersion Gold (DIG) surface for printed circuit boards	Bond-IQ	BOND IQ	01/2021	PDF
Quality assurance: Testing power electronics in minutes instead of months	F&S BONDTEC	SMT Insights	05/2020	E-Paper
Best Practice Guide Battery bonding	F&S BONDTEC	F&S Know-How	03/2020	F&S Article
Application Report: Improvement of a DoE for wire bon- ding process optimization through the use of the BAMFIT method	BOND IQ, Fraunhofer IZM Berlin and F&S Bondtec.	BOND IQ	08/2019	PDF
Application Report: Comparison of shear test and BAMFIT results as part of a wire bonding parameter investigation	BOND IQ, Fraunhofer IZM Berlin and F&S Bondtec.	BOND IQ	08/2019	PDF
Intelligent automation with robot handling	F&S BONDTEC	EPP Industrie	06/2019	E-Paper
BAMFIT – Bondtec Accelerated Mechanical Fatigue Interconnect Test: A Rapid Test for Reliability of Heavy Wire Bonds	Dr. Bernhard Czerny, TU Wien	EPP Europe	04/2019	PDF
Practical experience of F&S Bondtec equipment application in the precision electronic devises production	Morion, Inc.	n.a	n.a.	PDF