Simplify your COB processes by making elaborate and expensive special tooling history. The 5380 P&P platform can be used with standard tools for die sizes from 0.5 mm to 10 mm. Placement accuracy is akin to that of manual processes, but the advanced operator-assisting features like programmable adjustment heights, laser assisted positioning and high resolution optics guarantee a unique reproducibility. Huge programmable z-axis (maximum travel: 60 mm, resolution: 1 µm) and y-axis (maximum travel: 8 mm, resolution: 2 µm) allow very flexible assemblies. Each process step is highlighted on a super-sized 10.4 inch screen that discourages wandering operator attention during assembly.
Our wire bonding solutions combined with the 5380 P&P take
your electronic assembly experience to a whole new level with unique features
that no other manual machine can compete with
Die-attach is one element in a sum of parts. State-of-the-art COB processing is always the sum of many parts—new die-attach solutions need to be combined with other sophisticated equipment, such as the advanced 53xx series manual wire bonders and even fully automatic table-top 56xx series bonding machines. F&S Bondtec processing environments have a proven record in complex assemblies for medicine, automotive and sensor applications.
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