THE SOLUTION: SERIES 53
>> Complete, manual table top bonder
>> Unbeatable price-to-performance ratio
>> Extremely adaptable bond settings, loop shapes, force and power profiles etc.
>> Dual wire clamp system for reproduceable loop and tails
>> Easy handling
EXCHANGEABLE BOND HEADS
5310 – Gold-Ball 
>> Gold-Ball-Bonding for wires from 17,5 to 50 μm using Standard-Capillaries 16 mm to 19 mm
>> Dual frequency-US-generator for 60/100 kHz – further Bondfrequencies available on request
>> Bumping, Safety-Bump, Stitch-on-Ball
>> Programmable Z-Axis 60mm
5330 – Thin Wire Wedge-Wedge 
>> Wedge-Wedge-Bonding with 1“ Tools for Aluminum- and Goldwires from 17,5 to 75 μm and ribbon up to 250 x 25 μm
>> 45° wireguide, retrofitable to 30° and 60° – according to component geometry
>> Dual frequency-US-generator for 60/100 kHz further Bondfrequencies available on request
>> Programmable Z-Axis 60 mm and Y-Axis 25 mm
53XX BDA – Ball-Deep Access 
>> Deep Access Wedge-Wedge-Bonding with 1“ or ¾“ Tools
>> 90° wireguide for Aluminum- and Goldwires from 17,5 to 75 μm
>> Gold-Ball-Bonding for wires from 17,5 to 50 μm with capillaries 16 -19 mm
>> Perfect for difficult and constricted bonding geometries
>> Also useable for ribbon of aluminum und gold
>> Programmable Z-Axis 60 mm and Y-Axis 25 mm
>> optional: retrofitable to 5380 DIE-Bonder
5350 – Heavy Wire 
>> Heavy wire bonding for aluminum wire from 100 up to 500 µm diameter
>> Heavy wire bonding for copper wire from 100 up to 300 µm diameter
>> Wedge-Tool length from 50 to 70 mm also for extreme bonding requirements
>> Stitch- or chain bonds of any length
>> Clip-on-wire guide for quick exchange
>> Programmable Z-Axis 60mm and Y-Axis 25 mm
5350 HR – Heavy Ribbon 
>> Heavy Ribbon bonding for aluminum ribbons up to 2 mm width
>> Increased programmable bond force up to 6,000 cN, also with force and power ramps
>> Active ribbon guide to improve loop shaping
>> Programmable Z-Axis 60mm and Y-Axis 25 mm
>> Optional: retrofitable to 5350 HR heavy ribbon bondhead
5380 – DIE-Bonder
>> Different DIE-sizes process oriented useable
>> Manual DIE-bonding with Touchdown-Detection and programmable pickup- and bond force
>> 2 x 2“ working area for any Waffle-, Gel-Packs or Trays
>> Bond- and pickup force from 5 up to 500 cN programmable
