SERIES 53

F&S BONDTEC - Bonder - SERIES 53
Drahtbonder Serie 56

THE SOLUTION: SERIES 53

>> Complete, manual table top bonder

>> Unbeatable price-to-performance ratio

>> Extremely adaptable bond settings, loop shapes,
force and power profiles etc.

>> Dual wire clamp system for reproduceable loop and tails

>> Easy handling

EXCHANGEABLE BOND HEADS

5310 – Gold-Ball 

>> Gold-Ball-Bonding for wires from 17,5 to 50 μm using Standard-Capillaries 16 mm to 19 mm

>> Dual frequency-US-generator for 60/100 kHz – further Bondfrequencies available on request

>> Bumping, Safety-Bump, Stitch-on-Ball

>> Programmable Z-Axis 60mm

5330 – Thin Wire Wedge-Wedge 

>> Wedge-Wedge-Bonding with 1“ Tools for Aluminum- and Goldwires from 17,5 to 75 μm and ribbon up to 250 x 25 μm

>> 45° wireguide, retrofitable to 30° and 60° – according to component geometry

>> Dual frequency-US-generator for 60/100 kHz further Bondfrequencies available on request

>> Programmable Z-Axis 60 mm and Y-Axis 25 mm

53XX BDA – Ball-Deep Access 

>> Wedge-Wedge-Bonding with 1“ or ¾“ Tools

>> 90° wireguide for Aluminum- and Goldwires from 17,5 to 75 μm

>> Gold-Ball-Bonding for wires from 17,5 to 50 μm with capillaries 16 -19 mm

>> Perfect for difficult and constricted bonding geometries

>> Also useable for ribbon of aluminum und gold

>> Programmable Z-Axis 60 mm and Y-Axis 25 mm

>> optional: retrofitable to 5380 DIE-Bonder

5350 – Heavy Wire 

>> Wedge-Wedge-Bonding for aluminum heavy wire
from 100 to 500 μm diameter // copper from 100 to 300 μm

>> Wedge-Tool length from 50 to 70 mm also for extreme bonding requirements

>> Stitch- or chain bonds of any length

>> Clip-on-wire guide for quick exchange

>> Programmable Z-Axis 60mm and Y-Axis 25 mm

5350 HR – Heavy Ribbon 

>> Wedge-wedge bonding for heavy aluminum or copper ribbons up to 2 mm width

>> Increased programmable bond force up to 6,000 cN,
also with force and power ramps

>> Active ribbon guide to improve loop shaping

>> Programmable Z-Axis 60mm and Y-Axis 25 mm

>> Optional: retrofitable to 5350 HR heavy ribbon bondhea

5380 – DIE-Bonder

>> Different DIE-sizes process oriented useable

>> Manual DIE-bonding with Touchdown-Detection and programmable
pickup- and bond force

>> 2 x 2“ working area for any Waffle-, Gel-Packs or Trays

>> Bond- and pickup force from 5 up to 500 cN programmable

SERIES 53 IN ACTION