THE SOLUTION: SERIES 90
>> Maximum flexibility with a working area of 480 x 700 mm for a wide range of applications
>> Upgradeable to a fully automatic bond tester
>> Interchangeable bond heads for all wire bonding and test processes
>> Unlimited storage for bond programs
>> Highly adaptable bond settings, loop profiles, force and power parameters, and more
>> Most powerfull patern recognition system on the market
>> Innovative and intuitively programmable bonder software
>> 6 in1
COMMUNICATION INTERFACES
EXCHANGEABLE BOND HEADS
10i – Gold Ball
>> Gold-Ball bonding for wires from 12 to 50 μm diameter
>> Standard-Capillaries 16 mm to 19 mm
>> Bumping, Safety-Bump, Stitch-on-Ball
30i – Wedge-Wedge
>> Wedge-Wedge bonding using 1“ Tools Aluminum and Gold wires from 17.5 to 75 μm
>> 45° wire guide, retrofitable to 30° and 60°
32i -Depp Access
>> Manual and automatic testing of thin and heavy wire bonds
>> Test head with easly changeable cartridges
>> Patented solution for automatic angle correction
50i – Heavy Wire
>> Wedge-Wedge bonding for Aluminum from 100 up to 500 μm diameter // Copper from 100 up to 300 μm
50i HR – Heavy Ribbon
>> Wedge-Wedge bonding for Aluminum ribbon until 2 mm
00i -Pull-&Sheartester
>> Manual and automatic testing of thin and heavy wire bonds
>> Test head with easly changeable cartridges
>> Patented solution for automatic angle correction
