Category: News

F&S BONDTEC active in the matter In view of the general uncertainty about the new corona virus (COVID-19) and the current economic impact, we would like to provide you with all the information you need as a customer of F&S BONDTEC. First, F&S BONDTEC is…

Newest developments in BAMFIT Our partner BOND IQ GmbH is currently carrying out a potential evaluation of the BAMFIT method for interface evaluation on heavy wire bonds as an alternative to the heavy wire shear test. The project is being realized in close cooperation with…

25 years of F&S BONDTEC in pictures In the course of our company anniversary, we look back on the milestones in our company history. In the following article, we introduce you to some highlights from 25 years of F&S. We hope you enjoy watching our…

We are celebrating our 25th anniversary at the Productronica in Munich We are happy to invite you to celebrate together with us on 13.11.2019 from 18:00 at the Productronica in Munich the TWENTY-FIVE-YEARS anniversary of F&S BONDTEC. Our milestones In the course of our company anniversary we…

The AGH Racing Team Poland The AGH Racing is a Polish racing team participating in the Formular Student. The team consists of ambitious students whose dream is to build racing cars for the Formular Student Cup. F&S BONDTEC has supported the group of students in…

Once again there are some exciting news to report – this time from our top bonder: Series 58. In an internal experiment, we were able to bond gold Ball-Wedge with 12.5 μm wire. The results are convincing; Thus, we can now offer Gold Ball Wedge starting…

New BONDTEC Akademy From now on we offer new training modules for bondtester. The training modules include training packages for our 5600C(S) Pull- and Sheartester. With our experts, your installers, process- and qualitymanagers are in the best hands. The training will happen preferentaly in the premises of…

In order to bring our understanding of automated bond testing closer to our industrial customers, F&S BONDTEC and our distributor MPS organized a workshop in Suzhou China. In the practical part, customers could have their own products tested in the course of a demonstration on…

Low loop geometry (low-loop application) can be implemented most suitable while using reverse bonding from substrate to chip in combination with stich-on-bump. The basis for a robust process is the production of homogeneous bumps with a flat surface, that serves as a bonding surface for…