That was SMTconnect 2019 in Nuremberg

At SMTconnect we showed a huge range of our wire bonders and testers. The biggest innovation is the newly developed Bonderseries 86XX. The main difference to past series is the much larger working area of 720 x 512 mm in a robust and cost-effective design.…
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Battery Experts Forum Frankfurt

At #BatteryExpertsForum in Frankfurt over 100 leading users, developers, politicians and researchers from international companies and institutes were presenting the latest trends in the battery industry – such as: – Electric Mobility – Safety and Life-time – Battery Production – Next Gen Materials – Cell…
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SEMICON China – Thank you!

#SEMICONChina2019 has come to an end. We would like to thank the people that took the time to visit our booths, also our great partners from MPS for making our exhibition a resounding success! We are looking forward to meeting you again in 2020.
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We are represented at Semicon China

F&S BONDTEC is once again present at an international fair. Visit us at the Semicon China from the 20th to the 21st of March – you will find us at the MPS booth (Halle: N3 Stand: 3183)
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F&S BONDTEC on Internepcon 2019 in Tokio

F&S BONDTEC at Internepcon 2019 in Tokio From 16th to 18th January F&S BONDTEC participated at the annual Internepcon Show at the Tokyo ‚Big Sight‘ exhibition center. The Internepcon in Tokyo is a trade fair for manufacturing technology for production of electrical products. It is…
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New BONDTEC Academy

New BONDTEC Akademy From now on we offer new training modules for bondtester. The training modules include training packages for our 5600C(S) Pull- and Sheartester. With our experts, your installers, process- and qualitymanagers are in the best hands. The training will happen preferentaly in the premises of…
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SEMICON Taiwan / Future starts here

F&S Bondtec is once again present at an international trade fair. This time on the SEMICON Taiwan. Together with our representative Schmidt Scientific Taiwan Ltd, we were able to presented our broad range of products on site.
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Fair appearance NEPCON – Bangkok Thailand

For the first time, F&S BONDTEC was represented at the NEPCON Thailand in Bangkok. Together with our partner ASTRONICS Technologies we offer our customers a wide range of products.
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Workshop – automatic Bond testing: Suzhou – China

In order to bring our understanding of automated bond testing closer to our industrial customers, F&S BONDTEC and our distributor MPS organized a workshop in Suzhou China. In the practical part, customers could have their own products tested in the course of a demonstration on…
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Wire bonding and beyond – bumping technology for low-loop and Flip-chip application

Low loop geometry (low-loop application) can be implemented most suitable while using reverse bonding from substrate to chip in combination with stich-on-bump. The basis for a robust process is the production of homogeneous bumps with a flat surface, that serves as a bonding surface for…
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