News - F&S BONDTEC

September 27, 2019
News

Battery bonding for the AGH Racing Team

The AGH Racing Team Poland The AGH Racing is a Polish racing team participating in the Formular Student. The team consists of ambitious students whose dream is to build racing cars for the Formular Student Cup. F&S BONDTEC has supported the group of students in…

September 10, 2019
News

12.5 μm gold ball wedge bonding with the Series 58

Once again there are some exciting news to report – this time from our top bonder: Series 58. In an internal experiment, we were able to bond gold Ball-Wedge with 12.5 μm wire. The results are convincing; Thus, we can now offer Gold Ball Wedge starting…

June 11, 2019
Fairs

That was SMTconnect 2019 in Nuremberg

At SMTconnect we showed a huge range of our wire bonders and testers. The biggest innovation is the newly developed Bonderseries 86XX. The main difference to past series is the much larger working area of 720 x 512 mm in a robust and cost-effective design.…

April 15, 2019
Fairs

Battery Experts Forum Frankfurt

At #BatteryExpertsForum in Frankfurt over 100 leading users, developers, politicians and researchers from international companies and institutes were presenting the latest trends in the battery industry – such as: – Electric Mobility – Safety and Life-time – Battery Production – Next Gen Materials – Cell…

April 5, 2019
Fairs

SEMICON China – Thank you!

#SEMICONChina2019 has come to an end. We would like to thank the people that took the time to visit our booths, also our great partners from MPS for making our exhibition a resounding success! We are looking forward to meeting you again in 2020.

March 20, 2019
Fairs

We are represented at Semicon China

F&S BONDTEC is once again present at an international fair. Visit us at the Semicon China from the 20th to the 21st of March – you will find us at the MPS booth (Halle: N3 Stand: 3183)

February 5, 2019
Fairs

F&S BONDTEC on Internepcon 2019 in Tokio

F&S BONDTEC at Internepcon 2019 in Tokio From 16th to 18th January F&S BONDTEC participated at the annual Internepcon Show at the Tokyo ‚Big Sight‘ exhibition center. The Internepcon in Tokyo is a trade fair for manufacturing technology for production of electrical products. It is…

January 17, 2019
News

New BONDTEC Academy

New BONDTEC Akademy From now on we offer new training modules for bondtester. The training modules include training packages for our 5600C(S) Pull- and Sheartester. With our experts, your installers, process- and qualitymanagers are in the best hands. The training will happen preferentaly in the premises of…

September 21, 2018
Fairs

SEMICON Taiwan / Future starts here

F&S Bondtec is once again present at an international trade fair. This time on the SEMICON Taiwan. Together with our representative Schmidt Scientific Taiwan Ltd, we were able to presented our broad range of products on site.

September 19, 2018
Fairs

Fair appearance NEPCON – Bangkok Thailand

For the first time, F&S BONDTEC was represented at the NEPCON Thailand in Bangkok. Together with our partner ASTRONICS Technologies we offer our customers a wide range of products.