New BONDTEC Academy

New BONDTEC Akademy From now on we offer new training modules for bondtester. The training modules include training packages for our 5600C(S) Pull- and Sheartester. With our experts, your installers, process- and qualitymanagers are in the best hands. The training will happen preferentaly in the premises of…
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SEMICON Taiwan / Future starts here

F&S Bondtec is once again present at an international trade fair. This time on the SEMICON Taiwan. Together with our representative Schmidt Scientific Taiwan Ltd, we were able to presented our broad range of products on site.
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Fair appearance NEPCON – Bangkok Thailand

For the first time, F&S BONDTEC was represented at the NEPCON Thailand in Bangkok. Together with our partner ASTRONICS Technologies we offer our customers a wide range of products.
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Workshop – automatic Bond testing: Suzhou – China

In order to bring our understanding of automated bond testing closer to our industrial customers, F&S BONDTEC and our distributor MPS organized a workshop in Suzhou China. In the practical part, customers could have their own products tested in the course of a demonstration on…
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Wire bonding and beyond – bumping technology for low-loop and Flip-chip application

Low loop geometry (low-loop application) can be implemented most suitable while using reverse bonding from substrate to chip in combination with stich-on-bump. The basis for a robust process is the production of homogeneous bumps with a flat surface, that serves as a bonding surface for…
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Challenging Traditional Pull-Tester

Challenging Traditional Pull-Tester
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5600 CS – Fully Automatic Bond Tester

The 5600 CS fully automatic pull and shear tester can conduct independent pull and shear tests with automatic image recognition technology and programmable bond layouts. The automated process accelerates testing significantly, improves repeatability, and eliminates any interference by the operator affecting the test results. This…
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LAB-Tester 101

The most exciting feature of the LAB tester concept is not its functionality – despite its inspiring simplicity. It is the modular design and immediate availability of the systems. Finished systems can be dispatched to customers anywhere in the world within one working week. Learning…
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5700C XL – Large Area Bondtester

F&S Bondtec’s Large Area Bond Testerr is the only solution for electric mobility and panel-level processes available in the market. With an operating range of 700 x 700 mm2, the tester can handle large-format designs, such as wire-bonded battery modules, with ease. The gantry engine…
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OI-Option for our LAB-Tester (Optical Inspection System)

OI-Option for our Labtester (Optical Inspection System)
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