25 years of F&S BONDTEC in pictures

25 years of F&S BONDTEC in pictures In the course of our company anniversary, we look back on the milestones in our company history. In the following article, we introduce you to some highlights from 25 years of F&S. We hope you enjoy watching our…
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We are celebrating our 25th anniversary at the Productronica in Munich

We are celebrating our 25th anniversary at the Productronica in Munich We are happy to invite you to celebrate together with us on 13.11.2019 from 18:00 at the Productronica in Munich the TWENTY-FIVE-YEARS anniversary of F&S BONDTEC. Our milestones In the course of our company anniversary we…
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Battery bonding for the AGH Racing Team

The AGH Racing Team Poland The AGH Racing is a Polish racing team participating in the Formular Student. The team consists of ambitious students whose dream is to build racing cars for the Formular Student Cup. F&S BONDTEC has supported the group of students in…
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12.5 μm gold ball wedge bonding with the Series 58

Once again there are some exciting news to report – this time from our top bonder: Series 58. In an internal experiment, we were able to bond gold Ball-Wedge with 12.5 μm wire. The results are convincing; Thus, we can now offer Gold Ball Wedge starting…
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That was SMTconnect 2019 in Nuremberg

At SMTconnect we showed a huge range of our wire bonders and testers. The biggest innovation is the newly developed Bonderseries 86XX. The main difference to past series is the much larger working area of 720 x 512 mm in a robust and cost-effective design.…
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Battery Experts Forum Frankfurt

At #BatteryExpertsForum in Frankfurt over 100 leading users, developers, politicians and researchers from international companies and institutes were presenting the latest trends in the battery industry – such as: – Electric Mobility – Safety and Life-time – Battery Production – Next Gen Materials – Cell…
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SEMICON China – Thank you!

#SEMICONChina2019 has come to an end. We would like to thank the people that took the time to visit our booths, also our great partners from MPS for making our exhibition a resounding success! We are looking forward to meeting you again in 2020.
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We are represented at Semicon China

F&S BONDTEC is once again present at an international fair. Visit us at the Semicon China from the 20th to the 21st of March – you will find us at the MPS booth (Halle: N3 Stand: 3183)
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F&S BONDTEC on Internepcon 2019 in Tokio

F&S BONDTEC at Internepcon 2019 in Tokio From 16th to 18th January F&S BONDTEC participated at the annual Internepcon Show at the Tokyo ‚Big Sight‘ exhibition center. The Internepcon in Tokyo is a trade fair for manufacturing technology for production of electrical products. It is…
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New BONDTEC Academy

New BONDTEC Akademy From now on we offer new training modules for bondtester. The training modules include training packages for our 5600C(S) Pull- and Sheartester. With our experts, your installers, process- and qualitymanagers are in the best hands. The training will happen preferentaly in the premises of…
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