Newsletter April

Our Series 58XX – the fully automatic bonder on a desktop Newsletter April
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Semicon China 2016

Every year in Shanghai, the international trade fair for semiconductor technology “Semicon China” takes place. Meanwhile has, the Fair, founded in 1988, developed to be the largest and most comprehensive exhibition for semiconductor industry in China. Exhibitors from around the world present their latest products,…
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Semicon China – Shanghai 2017

Like every year, thousands of visitors have filled the halls of Semicon China in Shanghai. Many of these visitors had the opportunity to take an overview of our proucts, schich were exhibited by our representavice “Micro-Power-Scientific” (MPS). The business in China in growing every year…
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Newsletter March

Addition to the family of the series 53xx Newsletter March
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Bamfit-Tester

Bamfit-Tester
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Bondtester – manual and fully automatic

F&S BONDTEC Austria also provides bond testers and is one of a few companies on the market represented in industrial series production. In 2012, F&S BONDTEC Austria introduced the fully automatic 5600 tester platform ¬– the world’s first fully automatic bond tester with all the…
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10 reasons that make F&S BONDTEC Austria’s solutions unique:

Wire bonding and testing on one platform Lower investment costs for complete manufacturing solutions Ease of use even in fully automatic production of complex parts Shortest retooling times with lowest error rate Bonding solutions for the entire product lifecycle, from product development and series production…
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Customized production – the 56xx Desktop Micro Factory

The 56xx series and its unique head exchange principle is the perfect solution if you need to work in a variety of wire bonding processes and benefit from fully automatic wire bonding machine functions including pattern recognition. What advantages does the head exchange principle offer?…
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Productive wire bonding system for medium lot size production

The new 58xx series is a powerful new production solution by F&S Bondtec. Speed, precision and productivity features are the main focus of this latest generation of bonders. The 58xx systems operate at speeds up to 4x faster than the prior, already extremely successful 56xx…
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