Graphic visualization for fast error detection

Complex processes can easily be monitored and documented by using graphic visualization. The data analysis tool offers many possibilities and is upgraded continuously, such as: histograms including failure codes force/time plot bar and boxplot charts SPC using control charts individual value plots for trend and…
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Newsletter – SMT Hybrid Packaging 2016 in Nuermberg

The SMT Hybrid Packaging in Nuermberg is forthcomming. In this newsletter you will find all information about our booth and highlight of the fair. We are looking forward to see you there!
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Bonding processes need high-performance PRU

The stability of a bonding process is largely determined by the wire bonder’s pattern recognition unit (PRU). F&S Bondtec’s most sophisticated bonders, the 56xx and 58xx series, use advanced Asoss vision software that has been specially adapted to the requirements of wire bonders, to master…
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High-impact PRU parameters for stable pattern recognition

The system supports single- and dual-point recognition, including validation of the diagonal tolerance of two pattern recognition points—in both automatic and manual alignment. This precludes a bonding process beginning at a wrongly aligned component. Two systems are generally available for lighting, both of which allow…
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Once again ISO-certificated 2016

We are very proud to be able to inform you that we again have been rewarded for the new TÜV SÜD quality standards. Meanwhile for 15 years now we meet the requirements for the ISO 9001: 2008 certification.
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New standards in flexible high precision die-bonding

F&S Bondtec has just announced an advanced die-bonding solution to complement its flexible manual wire-bonding platform. The new 5380 P&P makes die-bonding as simple and precise as wire bonding, while retaining all the flexibility manual die-bonding processes offer. The hardware boasts finely tuned and high-quality…
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Ultrasonic supported die-bonding feature

State-of-the-art production processes need innovative ideas and technical approaches to meet the demands of automotive and other advanced industries. Over the last decade, the market has seen a deluge of increasingly advanced die-bonding materials. In addition to functioning as fixing elements, the materials boast advanced…
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Making the right choices in manual COB processing

Simplify your COB processes by making elaborate and expensive special tooling history. The 5380 P&P platform can be used with standard tools for die sizes from 0.5 mm to 10 mm. Placement accuracy is akin to that of manual processes, but the advanced operator-assisting features…
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F&K Delvotec GmbH becomes F&S Bondtec GmbH

Our sister company F&K Delvotec Bondtechnik GmbH in Ottobrunn, Germany, has changed the majority ownership to Strama-MPS Maschinenbau KG in Straubing, Germany and will put its focus even more strongly on the markets for automatic wire bonders and fully integrated production lines for the semiconductor…
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