At the SMT2016 exhibition you will be able to experience our latest development in automatic bond testing. The current software release is a huge step towards analyzing fully automatic measured pull and shear test values. The evaluation of the extensive data volume, which results from the automatic testing, will be as easy as pie. The user chooses the relevant test series and transfers it into the reports, which can be adjusted from customer to customer. Trends and problems can be analyzed directly on screen. This is a powerful opportunity, for those who evaluate the test results directly in production using the analysis software, in order to re-adjust the bonding parameters. The available tools and characteristics are based on efficient methods for statistical analysis. Needless to say, not only average values, standard deviation and minimum and maximum values, but also process parameters such as Cp- respectively Cpk-values can be determined.
Only an effective analysis of the test data will
reveal the full potential of automatic bond testing
