BAMFIT (Bondtec Accelerated Mechanical Fatigue Interconnection Test) is a completely new test method for estimating bond life and reliability of heavy wire wedge bonds. It is the perfect extension of the classic Power Cycling Test (PC): the cyclic stress of the wire bond due to temperature cycling is replicated by mechanical stress, but with significantly higher cycle speed. This allows PC tests, often lasting weeks or months, to be simulated within minutes.

BAMFIT fracture image shows the different shape of the interface much more clearly
BAMFIT fracture image shows the different shape of the interface much more clearly

Description: BF 2000

>> Maximum opening width 2 mm, with suitable BAMFIT and Opener tool.

>> Suitable for Al wires 100 μm – 500 μm and Al ribbons up to max. 2 mm width

>> Other wires and materials on request

>> The revolutionary BAMFIT-test can easily be implemented on every base unit of the 56XX series by installing a dedicated test head

>> The software is closely related to the standard versions for bonders and testers. It is capable of fully automatic testing of any number of bonds, employing automatic adjustments by pattern recognition

>> Test results are recorded in a SQL data base and can be evaluated at any time in a variety of ways


>> Test Head

The proprietary clamping tool grips the bond foot from the sides and at a defined height; a touchdown system automatically compensates height variations in the substrate

>> Test Tool

for heavy wires from 125 to 500 µm;
user-exchangable within minutes

>> Test Time

1 test < 1 minute

>> Test Force

Pull force in Z direction, typically 20 to 40 cN

>> Test Frequency

60 and 80 kHz, programmable Ultrasonice Generator

>> Test Amplitude

Corresponds to temperature swing in PC test; programmable between 0 and 1 µm

>> Test Data

Tool position and ultrasonic data are registered continuously and stored in a SQL data base for subsequent evaluation