BAMFIT (Bond Accelerated Mechanical Fatigue Interconnection Test) is an entirely new test method for assessing the bond reliability of heavy-wire wedge bonds. It is the perfect extension of the classic power cycling test (PC): the cyclic stress imparted to the wire bond by temperature changes is emulated by mechanical stress loading, but at a significantly higher cycle rate. This allows PC tests that can take weeks or months to be simulated within minutes.
The patent-pending BAMFIT tester thus permits a qualitative estimate of the lifetime and reliability of wire bonds, either as process diagnostics or for optimizing bond process parameters.
>> The revolutionary BAMFIT-test (test for bond reliability) can easily be implemented on every base unit of the 56XX series by installing a dedicated test head
>> The software is closely related to the standard versions for bonders and testers. It is capable of fully automatic testing of any number of bonds, employing automatic adjustments by pattern recognition
>> Test results are recorded in a database. Statistics and analysis can easily be done with the CSR (Corporate Standard Report) Software
>> Test Head
The proprietary clamping tool grips the bond foot from the sides and at a defined height; a touchdown system automatically compensates height variations in the substrate
>> Test Tool
for heaby wires from 125 to 500 µm;
user-exchangable within minutes
>> Test Time
1 test < 1 minute
>> Test Force
Pull force in Z direction, typically 20 to 40 cN
>> Test Frequency
60 and 80 kHz, programmable Ultrasonice Generator
>> Test Amplitude
Corresponds to temperature swing in PC test; programmable between 0 and 1 µm
>> Test Data
Tool position and ultrasonic data are registered continuously and stored in a database for subsequent evaluation. Statistics and analysis can easily be done with the CSR (Corporate Standard Report) software.