The new 58xx series is a powerful new production solution by F&S Bondtec. Speed, precision and productivity features are the main focus of this latest generation of bonders. The 58xx systems operate at speeds up to 4x faster than the prior, already extremely successful 56xx series, which introduced the innovative flexible bonding heads. The more rigid frame and housing construction of the 58xx decrease vibration and deformation, which allows verifiable repeatability of +/- 2 µm for every single bond.
Special attention has been paid to the software. In contrast to mass production, prototyping, system integration and small/medium lot size production users need programming and bonding strategies that can be applied quickly. The combination of mouse control and combo joystick with keypad has already proven successfully in practice. This ensures that single loops and complex programming with endless number of loops can be programmed quickly and precisely. Move, copy & repeat operations can be performed by mouse just as with a computer – simply mark the desired bonding positions and copy & repeat. The ability to rotate the bonding layout is a unique feature of our bonders. Chip and loop databases complete the software portfolio, reduce errors and save time.
“The best solution for R&D, pilot series
and medium lot size production”
