Ultrasonic supported die-bonding feature

F&S BONDTEC - News - Ultrasonic supported die-bonding feature
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State-of-the-art production processes need innovative ideas and technical approaches to meet the demands of automotive and other advanced industries. Over the last decade, the market has seen a deluge of increasingly advanced die-bonding materials. In addition to functioning as fixing elements, the materials boast advanced features like thermal conductivity, CTE compensation and gap spacing functionality. However, making the most of these advantages means adapting processes to the specific material properties.

This is where the 5380 P&P platform’s unique ultrasonic die-bonding feature comes into play. Ultrasonic waves ensure the functional particles added to such advanced die-attach materials are distributed evenly. The result is high-quality components with maximum performance.

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