Does this sound familiar to you? Wedge/Wedge bonding with aluminium wire, Ball/Wedge bonding with gold wire and every now and then a narrow housing that can only be processed with the slim bond head of a deep access bonder. A typical scenario for manufacturers of electronic systems using wire bonding technology.
This is where we come in, with our worldwide unique solution. Developed for unrivalled bonding head exchange, the 56 series allows a machine transition in under 2 minutes and offers all the features of a fully automatic production equipment with manual loading. Thin wires (diameter: 17 µm to 75 µm), heavy wires (diameter: 100 µm to 400 µm) and ribbons (thin and heavy ribbons) can be processed on one base machine. In addition to that pull and shear test heads are available for all bonding techniques.
“More than 10 years proven in
prototyping and small series production”
