Upgrade Recommandation for Serie 56 OS
This brings advantages such as:
– Improved security
– Future BONDSTAR software updates
The latest release of our BONDSTAR software will soon be available. In combination with the also new MCS-20 (Mobile Calibration System), automatic import of calibration data into the BONDSTAR software are enabled then. This avoids incorrect entries and saves time at once.
Our new MCS-20 can be used best with Bondstar Software Version 2.7, to automatically calibrate the bond force without operator interferences. With older Bondstar software releases, or bonders from third-party manufacturers, the calibration system can also be used stand-alone with a conventional Windows PC. The MCS-20 is therefore interesting for every user who wants to measure or calibrate a vertical force.
The temperature profile of the substrate or component holder is recorded by an external temperature sensor. The temperatures are determined and compensation can be carried out this way.
- Bond Weight Calibration System Thin Wire / MCS-20 (1 lb / 450 g)
- Bond Weight Calibration System Heavy Wire /MCS-20 (10 lb / 4.5 kg)
If you are interested, we look forward to your inquiry under:
+43 7722 67052-8278
or under: firstname.lastname@example.org