Wire bonding and beyond – bumping technology for low-loop and Flip-chip application

F&S BONDTEC - News - Wire bonding and beyond – bumping technology for low-loop and Flip-chip application

Low loop geometry (low-loop application) can be implemented most suitable while using reverse bonding from substrate to chip in combination with stich-on-bump. The basis for a robust process is the production of homogeneous bumps with a flat surface, that serves as a bonding surface for the following stitch bond. Our Bonders create such bumps by the bonding capillary using a shearing process. The software allows the adjustment of shear height, shear length and direction.

Due to the impressive bump quality, many companies use our wire bonder to bump chips and wafers for flip-chip-applications. Thus thermo-compression and dipping processes are possible without the previous coining of bumps. Wafers up to 6 inches can be fixed and processed effortless. We also produce clamping tools for bigger wafers, so that all bonding surfaces can be reached by moving and turning the wafer.

Dies to bump? With the right workholder this is no problem for our machines.

Our application engineers will give you full support while choosing the right bonding tools and materials and to determine the optimized process parameters –
We face your challenges!

Wire bonding or flip-chip – even if the technology is not yet defined,
our machines offer the perfect solution for your first prototypes

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