Wire BonderThe wire bonders from F&S Bondtec are flexible in their application and testify to the highest quality. Thanks to years of experience and proven technologies, the wire bonders of F&S Bondtec are always able to meet the high demands of its customers. For many years, the company has been characterized by its innovative strength and customer orientation. The wire bonders from F&S Bondtec offer the best quality and an unbeatable price-performance ratio. Characteristic of all our wire bonders are quick and easy changeable bondheads to support all necessary bonding processes. Equally important is an intuitive software that optimally supports the bonding process and thus enables the best possible result.
Bond TesterF&S Bondtec is the global market and technology leader in bond testing. From manual testers for quick tests, or fully automated solutions for low costs, F&S Bondtec offers the right solution for every requirement. No matter which solution you choose, each machine from F&S Bondtec comes with specially developed software. The intuitive user interface lets you create automatically generated reports in record time. The revolutionary BAMFIT test procedure is unique in the world. A special test head makes it easy to install on any 56XX series base unit.
Customized SolutionsThe product portfolio of F&S Bondtec also includes special machines. F&S Bondtec offers its customers individual solutions, which include services from the feasibility study through to production. Product training takes place regularly at the training center in Braunau am Inn.
EquipmentDue to the modular design, the machines from F&S Bondtec can be expanded almost as desired. Be it extension kits for additional bonding methods, or extended component receptacles. The right tool makes it perfect. Special bonding tools and spare parts around the topic of bonding complete the offer of F&S Bondtec.
For our customers we are approachable at any time for any questions on bonding technology.
Deutscher Verband für Schweißen und verwandte Verfahren
The DVS – Deutscher Verband für Schweißen und verwandte Verfahren e. V. is a technical-scientific professional association that is active in all areas of joining technology.
The International Microelectronics and Packaging Society (IMAPS) is a global association for microelectronics. The association has set itself the task of designing a common platform so that the requirements for the structure and connection technology are defined in a contemporary way.
Verband Deutscher Maschinen und Anlagen
With more than 3,300 members, the VDMA is the largest network organization and an important voice for mechanical engineering in Germany and Europe. The association represents the common economic, technical and scientific interests of this unique and diverse industry.