F&S BONDTEC - Ribbon


>> Gold or Aluminum ribbon, typically 12 x 75 µm
>> Mostly for microwave applications in mA range
>> Wedge process with very flat bonds
>> Bonding with heating for gold, without heating for aluminium

>> The bonder for ribbons has a wire feed angle of 90° and can also process wires. The bond assembly’s narrower contour is advantageous in limited geometries.

Machines for Ribbon