F&S BONDTEC - Heavy-Ribbon


>> Heavy Aluminium Ribbon up to 2000 x 300 µm cross section for even higher currents.

>> The bond head is a stronger version of the heavy wire bondhead.

What is Heavy-Ribbon Bonding?

Instead of a normal wire, it is also possible to bond ribbons. These ribbons, typically made of gold or aluminum, are precisely aligned and bonded using our machines with a dedicated bond head.

Ribbons up to 2000 x 300 µm cross-section for even higher currents, can be bonded on our machines.

Advantages of Ribbon Bonding over Wire Bonding

>> Enhanced Electrical Performance: Ribbon Bonding enables a significant reduction in the resistance and inductance of the connections, leading to improved electrical performance of the assembled electronic devices. This is especially crucial for high-frequency applications where signal integrity is critical.

>> Higher Current Carrying Capacity: The wider cross-sectional area of ribbon wires allows for better current carrying capacity compared to traditional wire bonding, making it ideal for power electronics and applications with demanding power requirements.

>> Improved Thermal Management: Ribbon Bonding provides a larger surface area for heat dissipation, resulting in enhanced thermal management. This is essential for devices that generate substantial heat during operation, as it helps prevent overheating and extends their lifespan.

>> Reliability and Durability: Ribbon Bonding offers excellent mechanical strength and long-term reliability, ensuring stable and secure connections between components. The robust bond withstands mechanical stresses and environmental conditions, contributing to its overall durability.

Machines for Heavy-Ribbon-Bonden