FAQ

The F&S BONDTEC software already includes most standard loop geometries.

If these standard geometries are not sufficient for your application, you can also use the Expert-Loop-Function. This is an extension of motion for complex applications.

The Wire-Catcher detects previously placed wires and corrects the position to the desired position. Attention is paid to twisting and misalignment so that the wire is placed correctly.

The Pad-Capture assists the programmer in centering the bonding points in the bond program.

F&S BONDTEC offers various log files and production data as standard export. However, data can also be transferred to customer-specific interfaces (TraceX-API).

TraceX-API is a software interface for traceability of F&S BONDTEC 56i / 58 / 86 – machines. An embedded Python script is loaded by the Bondstar software. The code is open and can be adapted to your own requirements. The software calls defined functions of the Python script and reports corresponding events. For more information on TraceX please see the following article: TraceX – Bring Traceability into your F&S BONTEC Bonder.

About once a year is recommended. This regular interval is the best way to avoid costly production downtimes. Regular maintenance is essential, even if your bonder is not used on a regular basis. If the machine is idle for a long time, the lubricating oils often dry up, which can have an impact on the positioning accuracy. A drive system that has not been maintained can then become stiff or even damaged.

One of the most important maintenance activities is checking all moving parts. The traversing axes are completely dismantled, cleaned, re-lubricated, and then reassembled and calibrated. These and other components have to be replaced or serviced. In general, the interior of the machine is freed from impurities during service that could disrupt operation. Wear parts such as belts and bearings are also replaced.

There is no general answer to that. Factors such as machine type or degree of wear play an important role. As a guide value for the duration of the machine downtime, 4 – 10 hours can be estimated. We will create an individual service offer for you – according to your requirements and the scope of your machine – just ask us. There is also the option of signing a maintenance contract for three years. With one of these, we can give you better conditions for your maintenance.

We will identify any existing problems with you in advance so that we have any necessary spare parts with us during the maintenance appointment.

Before the actual maintenance begins, our technicians carry out some bonds on a reference substrate. On the one hand, we then have a valid before-and-after result, and on the other hand, we can already assess the bonding process here. In addition, a bond weight calibration (MCS-20) is carried out and the function of the transducer is checked for inconsistencies using the TTS (Transducer Test System). This provides additional information on the machine’s condition and should be analyzed as well.

After maintenance has been done, we do tests together with the customer – on our reference substrate, but also with your substrate. This is often a good opportunity – from technician to technician – to exchange questions and experiences.

Should problems arise before scheduled maintenance, it is best to contact our service department directly. They will find a solution for you as soon as possible. The easiest way to do this is via the contact form at https://www.fsbondtec.at/service-support/ or by phone at +43 7722 67052-8289.

In the event of problems with the machine, a pre-installed Teamviewer can provide support from F&S BONDTEC.

(Internet connection required.)

At Clamp Tear (available at 5X30 machines) a wire clamp, which is placed behind the bonding tool, does a motion to tear the wire. The bond tool keeps relaxing on the second bond. Thus the force of the wire tear brings no stress to the second bond.

At Table Tear (only on Deep Access Wedge-Wedge) you have a wire guide behind the bonding tool. The bond head moves up and down in tear direction and then tears off the wire. The tear counter and the tear height can be set individually in the software.

At first glance, the two processes differ in that Singlewire the machine produces only a single bond wire, while with Multiwire it produces several wires in succession. The reason for this can be found in the respective areas of application.

Singlewire:
Singlewire-Mode is used, among other things, to set up the machine and to find the perfect bonding parameters. The Singlewire mode is also ideal for prototyping – because a wire connection is made between two points, which are approached by the user with the joystick for each wire separately without having to create a bonding program with chips and wires on beforehand.

Multiwire:
In Multiwire-Mode, a complex bonding program with chips and wires is created to set the system ready for production level. During this process, an automatic pattern recognition (PRU) can be programmed (optional).
The machine then executes this program as often as required and because of the automatic pattern recognition, always places the bonds precisely in the previously taught positions.

The Step-Mode can be activated at any time, whether in Singlewire or Multiwire operation. This mode allows to split the bond process or the bond cycle, wire by wire, into its individual parts and view them. This mode is often used for first bonding attempts in order to get an exact overview of the bonding process. Herewith you can immediately detect errors (mechanical or in the bondprogram), adhesion problems or over-deformation, you easily can counteract them. This mode can also be deactivated at any time. In Multiwire program, the remaining module will get bonded and in Singlewire the remaining bonding cycle is finished.

These two processes are applicable to SERIES 56i, SERIES 58 and SERIES 86 machines.