Category: Fairs

F&S BONDTEC - Fairs

That was SMTconnect 2019 in Nuremberg

At SMTconnect we showed a huge range of our wire bonders and testers. The biggest innovation is the newly developed Bonderseries 86XX. The main difference to past series is the much larger working area of 720 x 512 mm in a robust and cost-effective design.…
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Battery Experts Forum Frankfurt

At #BatteryExpertsForum in Frankfurt over 100 leading users, developers, politicians and researchers from international companies and institutes were presenting the latest trends in the battery industry – such as: – Electric Mobility – Safety and Life-time – Battery Production – Next Gen Materials – Cell…
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SEMICON China – Thank you!

#SEMICONChina2019 has come to an end. We would like to thank the people that took the time to visit our booths, also our great partners from MPS for making our exhibition a resounding success! We are looking forward to meeting you again in 2020.
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F&S BONDTEC on Internepcon 2019 in Tokio

F&S BONDTEC at Internepcon 2019 in Tokio From 16th to 18th January F&S BONDTEC participated at the annual Internepcon Show at the Tokyo ‚Big Sight‘ exhibition center. The Internepcon in Tokyo is a trade fair for manufacturing technology for production of electrical products. It is…
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SEMICON Taiwan / Future starts here

F&S Bondtec is once again present at an international trade fair. This time on the SEMICON Taiwan. Together with our representative Schmidt Scientific Taiwan Ltd, we were able to presented our broad range of products on site.
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Fair appearance NEPCON – Bangkok Thailand

For the first time, F&S BONDTEC was represented at the NEPCON Thailand in Bangkok. Together with our partner ASTRONICS Technologies we offer our customers a wide range of products.
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Semicon China 2016

Every year in Shanghai, the international trade fair for semiconductor technology “Semicon China” takes place. Meanwhile has, the Fair, founded in 1988, developed to be the largest and most comprehensive exhibition for semiconductor industry in China. Exhibitors from around the world present their latest products,…
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Semicon China – Shanghai 2017

Like every year, thousands of visitors have filled the halls of Semicon China in Shanghai. Many of these visitors had the opportunity to take an overview of our proucts, schich were exhibited by our representavice “Micro-Power-Scientific” (MPS). The business in China in growing every year…
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Review – SMT Hybrid Packaging 2016

We would like to thank all those of you who visited the F&S BONDTEC booth at the SMT Hybrid Packaging 2016. Once again, the SMT in Nuremberg did not disappointed us. With almost 500 exhibitors and over 18,000 visitors the SMT in Nuremberg is THE…
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Newsletter – SMT Hybrid Packaging 2016 in Nuermberg

The SMT Hybrid Packaging in Nuermberg is forthcomming. In this newsletter you will find all information about our booth and highlight of the fair. We are looking forward to see you there!
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