As in our other systems, the 58xx series includes convertible bonding heads for ball/wedge, wedge/wedge, heavy wire and ribbon bonding. Bonding tool, camera and wire guide are kept aligned with one another. For more critical applications, users can choose between working with a single bonding head and leaving the tool/wire exchange and alignment tasks to the operator or procuring a second precisely preconfigured head that is ready to take on all the latter tasks after a simple installation process. Our durable machine design with sealed housing fulfils the requirements of our customers and their production processes in terms of accessibility, cleanliness and security, including the software implemented configuration of individual user rights.
The 8 x 6 inch bonding area is more than twice that of the 56xx series, provides for PCB panels sized according to the European card format (100 x 160 mm) and leaves sufficient space for customized clamping systems. Motion controls and control units have been overhauled and fine-tuned to ensure smooth and precise movement. Once the operator has completed manual clamping, the rest of the process is fully automatic – image recognition, alignment, bonding… done.
Our 58xx has been completely overhauled and
reflects the needs of production processes.
More than 1000 of 5xxx series machines have been installed worldwide, proving that a sophisticated tabletop bonding system is the best solution. Companies across the fields of medical technology, high-frequency communication, automotive and industrial sensor technology, aerospace, oil and energy engineering, chip-on-board and optoelectronics have placed their trust in F&S Bondtec solutions.
