25 years of F&S BONDTEC in pictures
January 1, 1994
Two pioneers of wire bonding with over 100 years of technology experience between them, Dr. F. Farassat and Dipl. Ing. S. Kazemi founded F&S BONDTEC Austria in 1994. The first employees were three wire bonding specialists from the Braunau production facility of AEG-Telefunken which was transferred at that time to the Far East. Former headquarters was the Techno-Z in Braunau am Inn.
Release: Series 54
January 1, 1996
In 1996, our first wire bonder, the Series 54, was introduced.
Winner of the “Aenus” Award
January 1, 2001
Since 2001, companies, associations, organizations and individuals from the area around the Inn and the Salzach have been awarded the “Aenus Award”. The award honors companies that have set significant, cross-border achievements.
New construction of the company building
January 7, 2001
Due to the great success with the new generation of products, the space requirement for F&S BONDTEC also increased, not least because of the increasing number of employees, and so in 2001, the newly built company building was moved into.
Supplier Excellence Award by Sensata Technologies
January 1, 2006
We were honored with the Sensata Technologies Supplier Excellence Award 2006 for the close cooperation, above all with regard to quality assurance and new developments, but also with regard to powerful machines and excellent support. The sensor manufacturer assesses its suppliers for a complex, globally evaluated system in terms of cost, technology, quality, customer proximity, and many other criteria.
From 5600 product range develops 56XX
January 1, 2006
Under the high level of commitment of all employees, the 5600 range was expanded. This machine is characterized by its extremely high flexibility, since this device is now no longer just a bond tester, but excelled as a globally unique “wire bonder and wire bond tester 56XX”.
Winner of the “Best Business Award”
October 18, 2007
The “Best Business Award 2007” for sustainable business management was awarded on October 18 in Krumau. After intensive examination of the submissions submitted by companies from Eastern Bavaria, Upper Austria and Bohemia, the jury of the Entrepreneurs Award, which was awarded for the eighth time this year, awarded the “Best Business Award” for successful, sustainable business management.
“Editor’s Choice Award” in San Francisco
January 7, 2008
Semiconductor International, published by Reed Business Information and part of Reed Elsevier’s global suite of information products, is a leading technical publishing institution for the global semiconductor industry. We are pleased to receive the “Editors’ Choice Best Product Award” among the many high-class nominations.
Pegasus in silver (Business Award of the Upper Austrian News)
January 1, 2010
With the Pegasus, Upper Austria honors the best companies in the region. In 2010 F&S BONDTEC achieved victory in the category up to 49 employees.
Extension of company building
January 1, 2011
In year 2011 the building was expanded again and now about 40 employees work there. In total, several thousand wirebonders and testers have left the factory to be used in many laboratories, development departments, pilot lines and production floors of our customers worldwide.
January 1, 2015
Especially for medical technology and aerospace, a 100% functionality of the manufactured microchips must be guaranteed. That’s why the 5600C tester was created as an extension to the existing 56XX series. This was the first step of the Braunau team to move out of research and development into the field of mass production. That’s when they created a whole new product generation. The 58XX!
TWENTY-FIVE year exist of the F&S BONDTEC
November 8, 2019
In 2019, F&S BONDTEC once again celebrated many milestones. Among other things we celebrate the 25th anniversary of our company. We are motivated as in the beginning and look forward to being a leading player in the bonder industry in the future.
Productronica Innovation Award “Future Markets”
November 12, 2019
F&S BONDTEC wins the Future Markets Award at productronica: “F&S is revolutionizing bonding with an innovative rapid test – this is what lifts our industry into the future.” Thilo Brückner, judge of the productronica 2019 Accelerating Innnovation Award.