The 5600 CS fully automatic pull and shear tester can conduct independent pull and shear tests with automatic image recognition technology and programmable bond layouts. The automated process accelerates testing significantly, improves repeatability, and eliminates any interference by the operator affecting the test results. This increases productivity, reduces costs, and optimizes quality with a substantial reduction in interferences of the measurement system.
The fully automatic tester uses image recognition technology used in wire bonders to determine the position of a unit. A pre-defined test layout enables the device to access the target bond positions and initiate the tests. F&S Bondtec has deliberately chosen a programming methodology that is closely related to the wire bonders’ programming. The device is programmed on the individual bond layers (chips), with specific height data for each layer. The bond positions are assigned to the bond layers they are applied to. This approach is intuitive for the user and requires only little training – e.g. configuring the testing parameters, such as speed, shearing height, or hook alignment.
