Heavy-Wire-Wedge

>> for power devices, currents up to 50 A
>> Wedge bonding with cutter after 2nd bond
>> very robust process, extremely popular

>> Aluminium wire of 100 to 500 µm
>> CU Wire of 100 – 300 µm

Heavy-Wire-Wedge-Wedge bonding is a variant of wire bonding that uses a wedge-shaped tool to connect heavy wires to the bond pads of a substrate. With our 5350, 5650i, 5850 and 8650-bondheads, aluminum wire from 100 up to 500 µm diameter, and copper wire from 100 up to 300 µm diameter can be bonded.

It is possible to fix the component mechanically or by vacuum. Heavy-Wire-Wedge-Wedge bonding tools differ in a few ways. Details on the different tools can be found in the manufacturer’s data sheets. The most important parameters that need to be considered are:

>> Wire diameter

>> V-Groove

>> Bond tool length

>> Bond foot length (bond flat)

>> Frontcut or Backcut

For the interconnection of cylindrical lithium battery cells primarily heavy wire bonding is used. The technology is established in semiconductor technology and is characterized above all by high reliability and service life of the connections. In addition, the flexibility of the connection technology is a major advantage – different cell or module geometries do not require specially manufactured connector types but are simply realized by wire bonds of different lengths arranged in different orientations.

>> Because the first and second bond are of the same type, it is possible to bond from chip to substrate or in the opposite direction.

>> Better Looping – Wedge bonders inherently achieve the lowest possible loop heights.

Machines for Heavy-Wire-Wedge