We would like to thank all those of you who visited the F&S BONDTEC booth at the SMT Hybrid Packaging 2016.
Once again, the SMT in Nuremberg did not disappointed us. With almost 500 exhibitors and over 18,000 visitors the SMT in Nuremberg is THE industry meeting place for the latest products, services and solutions in all area of electronics manufacturing.
Highlights
Future Packaging:
Not just a manufacturing simulation – Under the leadership of the Fraunhofer IZM, 17 engineering and technology providers, united in the Future Packaging production line. But it did not only sticked to the presentation of pure production equipment. A wide range of exhibitors from the Components, Manufacturing Equipment, Components & Materials, Repair, Test & Traceability and Research flanked the production line.
We are proud that F&S BONDTEC was able to support the Future Packaging with the fully automatic standalone bondtester 5600CS and thereby once more proved how flexible our machines are. Take some time and have a look at the website of the Future Packaging.
Interview with Konradin Mediengruppe
Also big thanks to the Konradin Mediengruppe, which has done an incredible contribution to the best review of the SMT. With nearly 50 youtube videos you can get a good overview of the SMT. All interviews are summarized in a playlist.
F&S BONDTEC was also allowed to attend an interview. Mr. Siegfried Seidl, MAS (owner / manager) and Mr. Berger Stefan (Sales Manager) gave a shor explaition of the products from F&S BONDTEC.
