THE 5600Ci >> The automatic bond tester 5600Ci complements F&S Bondtec Semiconductor GmbH die- and wire-bonders. It is unique on the world market and patented. >> The PC controlled moving table allows any number of bonds to be tested automatically from a stored program. Results can be analysed and output immediately or exported in a number [...] Read More
BAMFIT TESTER BAMFIT (Bondtec Accelerated Mechanical Fatigue Interconnection Test) is a completely new test method for estimating bond life and reliability of heavy wire wedge bonds. It is the perfect extension of the classic Power Cycling Test (PC): the cyclic stress of the wire bond due to temperature cycling is replicated by mechanical stress, but with [...] Read More
Bond Pull Tester LAB-Tester LT-101 >> A high quality pulltester >> Simple and complete >> Requires no training >> For every budget >> Ready to go out of the box Make an inquiry now THE SOLUTION >> Work area 40 x 40 mm Z-Stroke 40 mm max. part size XY 200 x 150 mm >> Head is [...] Read More
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