SERIES 56

F&S BONDTEC - SERIES 56
Drahtbonder Serie 56

THE SOLUTION: SERIES 56

>> Unbeatable flexibility

>> Changeable bondheads for all wirebond and testing process

>> Fully automatic bonding with manual part feeding

>> Store an unlimited number of bond programs

>> Extremely adaptable bond settings, loop shapes, force and power profiles etc.

>> Most powerful pattern recognition system on the market

>> Innovative and intuitiv programmable software

>> 6 in 1

EXCHANGEABLE BOND HEADS

5610 – Gold-Ball 

>> Gold-Ball bonding for wires from 17,5 to 50 µm using stadard capillaries 16 mm to 19 mm

>> Highly sensitive, contactless electronic touchdown sensor and digitally controlled, programmable bond force for delicate component surfaces

>> Digital ultrasonic generator provides adjustable bond frequencies

>> Bumping, safety-bump, stitch-on-ball

>> Deformation Limit Control (DLC) for real-time quality checks

5630 – Thin Wire Wedge-Wedge 

>> Wegde-wedge bonding using 1″ tools  for aluminum and gold wirdes from 17,5 to 75 µm strength

>> 45° wire guide. convertible to 30° or 60° – depending on compontent geometry

>> Digital ultrasonice generator provides adjustable bond frequencies

>> Deformation Limit Control (DLC) for real-time quality checks

5632 – Thin Wire Deep Access 

>> Deep Access Wegde-Wedge bonding using 1″ or 3/4″ tools

>> 90° wire guide for aluminum and gold wirdes from 17.5 bis 75 µm

>> Perfect for difficult and constricted bonding geometries

>> Ideally suited for aluminum and gold ribbons

>> Deformation Limit Control (DLC) for real-time quality checks

5650 – Heavy Wire 

>> Heavy wire bonding for aluminum from 100 up to 500 µm diameter

>> Heavy wire bonding for copper wire from 100 up to 300 µm diameter

>> Wedge lengths of 50 up to 70 mm even for extreme bonding requirements

>> Stitch- or chain bonds of any length

>> Clip-on-wire guide for quick exchange

>> Deformation Limit Control (DLC) for real-time quality checks

5650 HR – Heavy Ribbon 

>> Heavy Ribbon bonding for aluminum ribbons up to 2 mm width

>> Increased programmable bond force up to 6,000 cN, also with force and power ramps

>> Active ribbon guide to improve loop shaping

>> Deformation Limit Control (DLC) for real-time quality checks

>> Optional: convertible from standard 5650 bond head

5650 – Pull- & Shear Tester 

>> For manual testing of thin and heavy wire bonds

>> Easy cartridge change

5600C – Automatic Pull- & Shear Tester

>> Test heads with exchangeable cartridges

>> Camera for automatic testing

>> Analysis software

SERIES 56 IN ACTION

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